| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC receptacle with which a contact will be brought into contacts with a reed by sufficient contact pressure, even if the number of parts is reduced with regard to the IC receptacle of ZIF(Zero Insertion Force) type, to an IC package loading jig to load the IC package to this IC receptacle, and to the IC package loading method in which the IC package is loaded to the IC receptacle using this IC package loading jig. SOLUTION: The IC package 90 is mounted on the housing 10, in a state with a lever part 112 having been pushed down, and a reed 91 is arranged between a contact part 113 and a support part 1021, by making the IC package 90 slide along the face 101 on which the IC package is mounted, and by releasing the lever part 112, the reed 91 is pinched and retained between the contact part 113 and the support part 1021. |
