| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure of electronic component which is excellent in heat dissipating property in addition to cost reduction. SOLUTION: An accommodation box is mounted in an engine room, and accommodates an electronic control unit 10. Between an inner wall surface of the box and an outer wall surface of a case 11 of the unit 10, a chamber having waterproofness into which cooling air for cooling the unit 10 is introduced and a chamber which is isolated from the above chamber and into which the cooling air is not introduced are formed. Conductor patterns 30, 31 for radiating the heat generated in heat generating elements are formed on a printed board 20 where an electronic control circuit is formed, and in contact with the case 11. All the heat generating elements 23 are arranged in the chamber into which the cooling wind is introduced.
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