| 摘要 |
PROBLEM TO BE SOLVED: To provide an easy to handle semiconductor without fear that the tip of a lead is deformed on a surface of a tape-shaped insulation base to which a semiconductor chip is fitted, and to provide an apparatus for manufacturing the semiconductor device, which is easy for the fitting. SOLUTION: The apparatus comprises: a chip stage 54, on which a semiconductor chip 34 is placed; a heating base 56, which is mounted on the chip stage 54 to heat the chip stage up to a specified temperature; a stage driving mechanism 47, which is located in the lower portion of the chip stage 54 to move the chip stage 54 up and down through a heat insulator 53; and a bonding tool 58, which is located up over the semiconductor chip 34 placed on the chip stage 54 and is able to move up and down, where the bonding tool 58 and the chip stage 54 sandwich and thermo-compression bond a chip bump 40 projecting from the semiconductor chip 34 and a tip 39 of a lead 36, which is formed by a copper foil 33 of an insulation base 32 held between the semiconductor chip 34 and the bonding tool on the chip stage 54, to press the insulation base 32 by the bonding tool 58.
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