| 摘要 |
PROBLEM TO BE SOLVED: To provide a CMP treatment system which can prevent dehydration, solidification of residual slurry and dehydration of an abrasive cloth and a cleaning apparatus, and can reduce consumption of purified water by putting the inside of the housing into a wet condition, and to provide a manufacturing method of a semiconductor device using the same. SOLUTION: The humidity inside the housing comprising a CMP (CMP apparatus) 2 and a cleaner (cleaning apparatus) 3 is controlled to a wet condition, such as 70%-100%. By putting the inside of the housing into a wet condition, this CMP treatment system can prevent dehydration, solidification of residual slurry and drying out of the abrasive cloth and the cleaning apparatus, improve cleanness, and reduce consumption of purified water due to the reduction or the elimination of a dummy dispense.
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