SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A semiconductor package and a method for fabricating the same are provided to reduce a fabricating cost and prevent a warpage phenomenon by using selectively a printed circuit board and a sealing portion as components of the semiconductor package. CONSTITUTION: A plurality of input and output pads(1a) are arranged on the first semiconductor chip(1). A conductive bump(3) is formed on a particular input and output pad(1a) of the input and output pads(1a). The particular input and output pad(1a) is located on a center portion of a lower face of the first semiconductor chip(1). The conductive bump(3) is formed by using metals such as solder(Pb/Sn) or gold. The conductive bump(3) is formed by using one of an electro plating method, an electroless plating method, an evaporation method, a sputtering method, and a printing method. The second semiconductor chip(2) is formed on a lower face of the first semiconductor chip(1). A plurality of input and output pads(1a) are arranged on the second semiconductor chip(2). The first and the second semiconductor chips(1,2) are bonded to each other by using a flip chip connection method. A plurality of conductive balls(4) are formed on each input and output pads(1a).