SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A semiconductor package and a method for fabricating the same are provided to form the semiconductor package having prominent heatproof performance for stacking various kinds of semiconductor chips. CONSTITUTION: The first semiconductor chip(1) has a plurality of input and output pads(1a). An adhesive layer(5) is formed on an upper face of the first semiconductor chip(1). The second semiconductor layer(2) is adhered to the first semiconductor layer(1) by the adhesive layer(5). A plurality of input and output pads(2a) are formed on an inner circumference of a lower face of the second semiconductor chip(2). A printed circuit board(10) is adhered to a lower face of the first semiconductor chip(1) by the adhesive layer(5). The input and output pads(1a) correspond to through-holes(14) of the printed circuit board(10). A plurality of patterns(12) are formed on outer circumferences of the through-holes(14). The printed circuit board(10) includes a resin layer(11), a wiring pattern having a land(12b) and a bond finger(12a), and a cover coat(13).