| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for fabricating a semiconductor device which has a bonding pad and multiple layer wiring overlapping with the active region of the semiconductor device, and by the method, simplification of the manufacturing process and reduction of the size of the equipment are achieved at the same time, and freedom of arrangement position of bonding pad and connection between semiconductor devices can be improved. SOLUTION: A secondary wiring layer 7 is formed on a wiring layer 2 connected to the active layer of a silicon substrate through an interlayer insulation film 6. A bonding pad 14 is placed on a secondary wiring layer 7 through a protection film 8 and a polyimide film 10 in order to overlap the active region of the silicon substrate 1. A plurality of wirings 7a and 7b of the secondary wiring layer 7 is provided in a region overlapping the bonding pad 14. One of wiring 7a is connected to the bonding pad 14 through openings 9 and 11 of the protection film 8 and the polyimide film 10 and the protection film 8 and polyimide film 10 are placed between another wiring 7b and the bonding pad 14. |
