| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a low temperature baking ceramic circuit board whose wire bonding strength is ensured. SOLUTION: In a low temperature baking ceramic circuit board 10 for baking a ceramic green sheet lamination, a bonding pad 41 or a flip chip connection pad 42 is formed of conductive paste consisting of an Ag-base metallic element and amorphous glass frit at 800 to 1,000 deg.C, an operation point temperature of amorphous glass frit is lower than a baking temperature of ceramic green sheet, and amorphous glass frit is incorporated in conductive paste 0.5 to 10.0 wt.% (solid content ratio).</p> |
