| 摘要 |
PROBLEM TO BE SOLVED: To provide effective technology to efficiently manufacture a multilayer printed wiring board having an interstitial via hole structure, at high yields. SOLUTION: Either glass fabric epoxy resin, glass unwoven fabric epoxy resin, glass fabric bismaleimide triazine resin, or aramid unwoven fabric epoxy resin is hardened into a plate-like shape to form insulating hard substrates (2a and 2b). On one face of each substrate, a conductor circuit (3a and 3b) and an adhesive layer (4a and 4b) are formed, and in the other face of the substrate, a hole reaching the conductor circuit is formed and then is filled with conductive paste 5 to form a via hole (6a and 6b) filled with the conductive paste 5 so supplied as to be salient and flat on the substrate face. Thus, single- sided circuit boards (7a and 7b) for a multilayer printed wiring board are fabricated. A multilayer printed wiring board 1 having the IVH structure fabricated using the single-sided circuit boards (7a and 7b) is provided. A method of manufacturing the multilayer printed wiring board 1 at high yields is also provided. |
