| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for forming a bump electrode on a wafer by plating, which exhausts bubbles from plating solution in a plating cup and reduces variation of the plating solution flow to the periphery wall of the plating cup. SOLUTION: A plurality of grooves 21, each of which has almost V-shape, are formed on the upper surface of the periphery wall of a cup 2 at equal intervals. The grooves 21 can exhaust the bubbles from plating solution 4 in the cup 2 and can reduce the variation of the flow rate of the plating solution 4 to the periphery wall of the plating cup 2.
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