| 摘要 |
PURPOSE: An optical interconnection device using an optical interconnection bar is provided to perform rapidly a signal transmission operation between semiconductor chips by inserting the optical interconnection bar into an optical substrate including a light waveguide. CONSTITUTION: A solder chip(S1) is adhered between the first printed circuit board(10) and the second and the third printed circuit boards(20,30) by using a flip chip solder bonding method. The first and the second semiconductor chips(3,8), a laser drive chip(4), a surface-emitting light source array(5), an optical detector array(6), and an optical receiver chip(7) are adhered on the first printed circuit board(10) by using the flip chip solder bonding method. A plurality of through-hole(50,50-1,51,51-1) is formed on the second and the third printed circuit boards(20,30). A plurality of optical interconnection bar array(52,52-1,53,53-1) is inserted through the through-holes(50,50-1,51,51-1) in order to provide an optical signal of the surface-emitting light source array(5) to optical detector array(6).
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