| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate such a problem that when a small-size electric element is built in, an electric connection between the electric element and a circuit on the wiring board side cannot be easily and reliabily established. SOLUTION: The wiring board comprises an insulation substrate 1 made by laminating insulation layers 1a-1c each of which contains at least organic resin, a plurality of wiring circuit layers 2 formed on the surface of and/or inside the insulation substrate 1, and via hole conductors 3 made by filling via holes at least inside the insulation substrate 1 with a metal component. The electric element 5 having an inner interconnection 7 is build in inside a hollow part 4 formed in the wiring board to form an electric element built-in wiring board. In the electric element built-in wiring board, a connecting conductor section 8 is formed by filling a through hole extended through the electric element 5, or a through hole or space formed in the interface between the electric element 5 and a wall face of the insulation layer formed with the hollow part 4, with a metal component. The inner interconnection 7 of the electric element 5 and the via hole conductor 3 on the wiring board side and/or the wiring circuit layer 2 are electrically connected via the connecting conductor section 8.</p> |
