发明名称 DRY ETCHING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device in which mesa sidewalls have excellent verticality and flatness. SOLUTION: A manufacturing method of the semiconductor device, in which a semiconductor substrate 100 is etched by using a photoresist 102 including sulfur, in the manufacturing method of the semiconductor device including a dry etching process using a chlorine gase.
申请公布号 JP2002198359(A) 申请公布日期 2002.07.12
申请号 JP20000398165 申请日期 2000.12.27
申请人 CANON INC 发明人 UCHIDA TATSURO
分类号 G01C19/66;H01L21/302;H01L21/3065;H01S5/02;(IPC1-7):H01L21/306 主分类号 G01C19/66
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