STRUCTURE OF LAND OF SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A structure of a land of a semiconductor package and a method for fabricating the same are provided to enhance reliability of connection between a semiconductor package and a mother board. CONSTITUTION: A printed circuit board(10) is formed with a conductive package land(12) and an insulating layer(14) including a plurality of holes(14a). The conductive package land(12) is formed on an upper face of the printed circuit board(10). The insulating layer(14) is adhered to a lower face of the conductive package lands(12). The insulating layer(14) has a plurality of holes(14a) with a constant diameter. A plurality of semiconductor chips are formed on an upper portion of the printed circuit board(10). An encapsulation portion(20) is formed on an upper portion of the above structure. A conductive body(40) is formed on a lower face of the package land(12) corresponding to an inside of the hole(14a) of the insulating layer(14).