| 摘要 |
PURPOSE: A wafer cleaning apparatus is provided to prevent a particle and to control a descending speed of a brush arm by improving a structure. CONSTITUTION: A wafer cleaning apparatus comprises an arm(2), a brush(1) installed on one end of the arm(2), a supporting shaft(3) supporting the arm(2), the first motor(5) driven to circulate the brush(1) so as to perform a cleaning on a wafer, the second motor(6) driving the arm(2) to and fro so as to move the brush(1) from a stand-by position to a cleaning position, a timing belt(7) connecting the second motor(6) to the lower portion of the supporting shaft(3), an air cylinder(8) as an up and down displacement driving part moving the supporting shaft(3) up and down, a descending position fine controller(10) minutely controlling the position of the brush(1), and a piston of the air cylinder(8) controlling the descending speed of the brush(1), so that a contact impact between the brush(1) and the wafer is prevented, thereby restraining particles.
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