| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component and an electronic component mounting table which can surely mount conductive particles on an electrode. SOLUTION: A transfer substrate made of silicon is coated with volatile solvent containing the conductive particles. Then, the electronic component is produced by evaporating the solvent. Furthermore, the electronic component mounting table is configured, to hold the electronic component having bump electrodes or electrode terminals by other portions than the bump electrodes and the electrode terminals of the electronic component. |
