SUBSTRATE SURFACE TREATMENT APPARATUS AND SUBSTRATE SURFACE TREATMENT METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate surface treatment apparatus and a substrate surface treatment method which can process a substrate surface treatment evenly on the substrate surface. SOLUTION: A wafer W being rotated on a hot plate and heated at a predetermined temperature is exposed to a hydrofluoric acid vapor supplied from a slender slit 93a formed on a rectifier plate 93 above the wafer W to remove an oxide on the wafer surface. The slit 93a is arranged so as to cross the rotation axis of the wafer W and it is longer than the diameter of the wafer W.