发明名称 APPARATUS FOR RESIN-SEALING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To eliminate positional deviation of a lead frame at sealing die position, and to eliminate positional deviation of a lead of a sealed package. SOLUTION: An image recognition device 5 takes an image of the sealed package 8 after resin-sealing, positional deviation of the lead of the sealed package is detected by using the image, and a correction signal 101 is output. A controller 1 controls a servo-motor 10 by using the correction signal 101, to correct the positional deviation of the lead frame 7. This eliminates the positional deviation from the next cycle operation. If the positional deviation of the lead exceeds a threshold value, the controller outputs a stop signal 102 to stop the operation of the apparatus and simultaneously display an alarm.
申请公布号 JP2002198386(A) 申请公布日期 2002.07.12
申请号 JP20000393311 申请日期 2000.12.25
申请人 SAINEKKUSU:KK 发明人 YUSA MASANOBU
分类号 B29C45/14;B29C45/76;H01L21/50;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/14
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