| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem due to the fact that stress is initially applied to a brazing material reservoir with different thermal coefficient from an I/O terminal, a metal frame body and a substrate and passes through the above media in this order, finally causing cracks in the I/O terminal, that the transmission characteristics of a high-frequency signal and airtightness in the semiconductor package is lost, and that a semiconductor device cannot be operated normally. SOLUTION: The optical semiconductor package 4 has the I/O terminal 3 that is fitted and joined to a mounting section 5 that is provided at the metal frame body 2 by a brazing material. The mounting section 6 is provided at the side section of the metal frame body 2 so that the mounting section 6 does not touch the upper surface. At the same time, a groove 8 is formed from a corner section 7 at the lower end of the mounting section 6 of the inner surface and/or outer surface of the metal frame body 2 to the upper surface of the substrate 1.
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