| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing an IC card having a smooth surface, thereby having superior appearance and printability, besides superior in heat resistance, reliability in moisture proof characteristic and part connection reliability of the IC card. SOLUTION: An IC card substrate is mounted with a plurality of parts such as an IC chip, a capacitor. An adhesive insulation layer made of thermoplastic material of a melt flow rate >=0.1 g/10 min and a skin layer for protection are pressed and fitted thermally to at least one surface of the IC card substrate. |
