SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A semiconductor package and a method for fabricating the same are provided to prevent the generation of flash after performing a sealing process. CONSTITUTION: A plurality of input and output pads(4) are formed on a lower face of a semiconductor chip(2). A plurality of lead(8) are arranged on the semiconductor chip(2). A plurality of partial etching portions(8a) are formed on each end portion of the leads(8). A plurality of conductive bumps(6) are fused on each input and output pads(4) of the semiconductor chip(2). The conductive bumps(6) are connected with upper faces of the leads(8) in order to transmit electric signals of the semiconductor chip(2) to the leads(8). The conductive bumps(6) are formed by Cu, Fe, or Cu alloy. A sealing portion(14) is formed on the semiconductor chip(2) and the conductive bumps(6).