PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A printed circuit board and a semiconductor package using the same are provided to perform easily a flux dotting process and a ball bumping process and realize easily a fine pitch of a ball array. CONSTITUTION: A chip loading portion(14) is formed on a center portion of an upper face of a resin layer(11). A semiconductor chip is adhered to the chip loading portion(14). Circuit patterns(12) having bond fingers(12a) are formed on an outer circumference of the chip loading portion(14). The circuit patterns(12) having ball lands(12b) are formed on a lower face of the resin layer(11). The circuit patterns(12) of the upper face and the lower face of the resin layer(11) are connected to each other by a via hole(13). An insulating solder mask(15) is coated on a whole surface of the resin layer(11) except for the bond fingers(12a) and the ball lands(12b) and the circuit patterns(12). A concave portion(12c) is formed on the exposed ball land(12b).