CONDUCTOR STRIP ARRANGEMENT FOR MOLDED ELECTRONIC COMPONENT AND PROCESS FOR MOLDING

摘要

PROBLEM TO BE SOLVED: To provide a conductor strip arrangement for a molded electronic component with which the electronic component can be taken up without difficulty by an automatic assembly machine and positioned on a printed circuit board, and a process for molding such an electronic component. SOLUTION: The manufacturing process and the conductor strip arrangement for a molded electronic component are so constituted that at least one semiconductor element is located on an electrically conducting conductor strip. Around the conductor strip and the semiconductor element, a housing made of a molding material is arranged such that there are still sections of the conductor strip outside the housing. The sections of the conductor strip are enlarged in some sections such that these sections are directly adjacent to the later housing or even protrude into the housing in order to prevent the formation of a ridge. The manufacturing process and the conductor strip arrangement are particularly suitable for the production of molded electronic components whose separation plane runs through that housing surface which serves as docking surface for a suction needle.