| 摘要 |
PURPOSE: A wet etching equipment is provided to improve an etch uniformity of a wafer by simultaneously etching both surfaces of the wafer and to minimize contamination by minimizing a contact area with the wafer. CONSTITUTION: The wet etcher comprises a spinner(10) for rotating, a chuck(30) for loading a wafer(20) to mount at end portion of the spinner(10), and sprays(40,50) located at upper and lower portions of the wafer(20) for spraying chemical solutions. The chuck(30) further comprises a plurality of arms and a clamp. Preferably, the arms are composed of eight.
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