SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, CONTACT STRUCTURE, AND METHOD OF FORMING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can be decreased in contact resistance and high in reliability by increasing a contact surface area between a conductor layer and a conductive member, and also to provide a method for manufacturing the semiconductor device. SOLUTION: The semiconductor device includes a cell plate layer 5 formed in an insulating films 10 and 11 on a semiconductor substrate 4, a connection hole 12 formed as passed through the insulating films 10 and 11 and the cell plate layer 5, and a conductor plug 7A formed to expose the periphery, e.g. upper surface of the layer 5 contacted with the connection hole 12 and so that a conductor is filled in the connection hole 12.