| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which satisfies both long term connection strength of a solder ball and wire bonding property, and its manufacturing method. SOLUTION: A wiring board 20 has an insulating substrate 1, a via hole 3 provided to an insulating substrate and a wiring conductor 2 provided to the insulating substrate 1. A gold plating layer 9 of a rear of a wiring conductor inside a via hole, which is formed by an electroplating method, is made thinner than a gold plating layer 7 of a front surface of the wiring conductor 2. The manufacturing method relates to the wiring board 20 with the via hole 3 and the wiring conductor 2. The gold plating layer 9 of a rear of the wiring conductor 2 inside the via hole 3 is made thinner than the gold plating layer 7 of a front surface of a wiring conductor by an electroplating method. |
