| 摘要 |
PROBLEM TO BE SOLVED: To greatly shorten inspection time. SOLUTION: The focus adjusting method of a head chip inspection system is provided for inspecting a number of head chips incorporated in a device layer laminated on a substrate. In this case, focusing reference surfaces 5a are formed on the three places of the device layer surface outside a head chip forming area 22, a focal surface for covering the head chip area 22 is calculated based on focal distance adjustments to the reference surfaces 5a, and the focus of the head chip inspection system to each heat chip is set on the focal surface 5a in each head chip position.
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