发明名称 EQIPMENT FOR TRANSFERRING BONDING PAST, TRANSFER PIN AND METHOD FOR TRANSFERRING BONDING PAST
摘要 PROBLEM TO BE SOLVED: To provide an equipment for transferring bonding past, a transfer pin and a method for transferring the bonding paste, in which the bonding past is applied to a work without any trouble by transferring by stabilizing the application quantity. SOLUTION: The transfer face of the lower edge 22a of the transfer pin 22 for transfer of the bonding part to a rectangle coating area provided on a work face of a plane face having a plane face 22b parallel to the coating plane of the work provided corresponding to a diagonal coating line settled by connecting the diagonal line of the coating region and an inclined portion having a inclined face 22c inclined to outer periphery formed in the range out of the flat portion. By this, the bonding past is surely applied to corner points, also the amount of the bonding past adhered to the transfer face is easily regulated by regulating the burying depth of the transfer pin in the bonding past.
申请公布号 JP2002198382(A) 申请公布日期 2002.07.12
申请号 JP20000391944 申请日期 2000.12.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HIRAKI TSUTOMU
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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