| 摘要 |
PROBLEM TO BE SOLVED: To realize a wiring layer which can reduce a parasitic capacitance between wirings. SOLUTION: A wiring layer wherein a damascene wiring structure having high-level wirings 14 and 15 and a damascene wiring structure having low-level wirings 9 and 10 is formed, and a distance L between the two adjacent damascene wirings structures is set to be long.
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