| 摘要 |
PROBLEM TO BE SOLVED: To improve the strength of a tray, to prevent an insulating substrate where the lead terminal of a semiconductor package has been bent from being damaged in pile-up, and to prevent the insulating substrate on the like from being damaged since the semiconductor package moves extremely within a recess due to vibration and shock in transportation. SOLUTION: The semiconductor package 5 has the recess 10a on the main surface at the upper side of a plate made of resin, a semiconductor device mounting section on the upper surface of the insulating substrate 1, a metal heat radiation member 2 at the center of the lower surface, and a lead terminal 3 extended downward at the outer-periphery section of the lower surface are provided on the upper surface of the insulating substrate 1. The package is accommodated in the recess 10a in the lower surface side down. At the same time, the packaging container comprises the tray 10 that is piled up and down, and a middle plate 11 made of resin where a projection 11a is formed at a site being equivalent to the metal heat radiation member 2 on the main surface of the lower side while the middle plate 11 is arranged between the trays 10.
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