| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which enables efficient transmission and radiation of heat generated from semiconductor components by means of heat transmission members such as thermal via holes when mounting the semiconductor components on a multilayer circuit board, and which is suppressed with the warp, and also to provide a method of manufacturing the same. SOLUTION: The circuit board 10 comprises a plurality of the thermal via holes 8 which are formed in an insulation substrate 1 and extended through the thickness of the insulation substrate 1. For the paste with which the thermal via holes 8 are to be filled, such paste that is mainly formed of Ag and includes Ag powder whose average grain diameter is 5 μm or above and Ag powder whose average grain diameter is 1 μm or below. |
