ABRASION METHOD FOR SEMICONDUCTOR WAFER BY USING CHEMICAL MECHANICAL POLISHING DEVICE

摘要

PURPOSE: An abrasion method for semiconductor wafer by using chemical mechanical polishing device is provided to improve the flatness of the semiconductor wafer by controlling the abrasion amount of the wafer uniformly from the center portion to the peripheral portion. CONSTITUTION: An abrasion method for semiconductor wafer by using chemical mechanical polishing device includes the steps of loading a semiconductor wafer on a head(50) mounted on a supporting frame of head shaft(70), abrasion the wafer chemically and mechanically by supplying slurry between the wafer and a polishing pad(20) while rotating the polishing pad(20) which is closely contact with the wafer and the head(50), unloading the wafer from the head(50), wherein the head supports the wafer allowing the peripheral portion of the wafer to be deviated from the polishing pad and the abrasion is carried out by reciprocally moving the head so that the peripheral portion of the wafer contact with the polishing pad less than the central portion of the wafer. thereby the amount of abrasion of the wafer is uniform from the peripheral portion to the central portion.