| 摘要 |
PURPOSE: A semiconductor package is provided to reduce a fabricating cost of a semiconductor package by mounting a semiconductor chip on a low-priced lead frame. CONSTITUTION: A couple of leads(1) including the first side(1a) and the second side(1b) is faced to each other. The leads(1) are formed by Cu, Fe, or Cu alloy. A semiconductor chip(2) has the first side(2a) and the second side(2b). The first side(2a) of the semiconductor chip(2) is directed to the second side(1b) of the lead(1). A plurality of input and output pads(2c) is formed on the first side(2a) of the semiconductor chip(2). Each input and output pad(2c) is electrically with a bump land of the second side(1b) of the lead(1) by a conductive bump(3). A sealing portion(5) is formed on the semiconductor chip(2), the conductive bump(3), and the lead(1) except for the first side(1a). |
