发明名称 EXHAUST ELECTRODE FOR DRY ETCHING APPARATUS AND PROCESS CHAMBER OF DRY ETCHING APPARATUS FOR MANUFACTURING SEMICONDUCTOR APPARATUS
摘要 PURPOSE: An exhaust electrode for dry etching apparatus and process chamber of dry etching apparatus for manufacturing semiconductor apparatus is provided to uniformly form a plasma on a wafer by symmetrically forming a plurality of exhaust outlets around an electrode. CONSTITUTION: An electrode plate(12) is attached to an upper side of a housing(13). A plurality of exhaust outlets(14) connected to an exhaust tube(14) is symmetrically formed to a side wall of the housing(13). A plasma having a uniform ion density is formed on the electrode plate(12) because a plurality of exhaust outlets(14) connected to the exhaust tube(14) is symmetrically formed to the side wall of the housing(13). A wafer(5) located on the electrode plate(12) is uniformly etched because a plurality of exhaust outlets(14) connected to the exhaust tube(14) is symmetrically formed to the side wall of the housing(13).
申请公布号 KR20000024761(A) 申请公布日期 2000.05.06
申请号 KR19980041441 申请日期 1998.10.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, TAE HUN;KIM, BYUNG CHEOL;KO, DONG HWAN
分类号 H01L21/302;H01J37/32;H01L21/3065;(IPC1-7):H01L21/306 主分类号 H01L21/302
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