发明名称 |
EXHAUST ELECTRODE FOR DRY ETCHING APPARATUS AND PROCESS CHAMBER OF DRY ETCHING APPARATUS FOR MANUFACTURING SEMICONDUCTOR APPARATUS |
摘要 |
PURPOSE: An exhaust electrode for dry etching apparatus and process chamber of dry etching apparatus for manufacturing semiconductor apparatus is provided to uniformly form a plasma on a wafer by symmetrically forming a plurality of exhaust outlets around an electrode. CONSTITUTION: An electrode plate(12) is attached to an upper side of a housing(13). A plurality of exhaust outlets(14) connected to an exhaust tube(14) is symmetrically formed to a side wall of the housing(13). A plasma having a uniform ion density is formed on the electrode plate(12) because a plurality of exhaust outlets(14) connected to the exhaust tube(14) is symmetrically formed to the side wall of the housing(13). A wafer(5) located on the electrode plate(12) is uniformly etched because a plurality of exhaust outlets(14) connected to the exhaust tube(14) is symmetrically formed to the side wall of the housing(13).
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申请公布号 |
KR20000024761(A) |
申请公布日期 |
2000.05.06 |
申请号 |
KR19980041441 |
申请日期 |
1998.10.01 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, TAE HUN;KIM, BYUNG CHEOL;KO, DONG HWAN |
分类号 |
H01L21/302;H01J37/32;H01L21/3065;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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