| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a low-temperature baked ceramic wiring board which can effectively suppress the shrinkage arising from baking while keeping a good surface state of a substrate sheet even when a large-area and thick wiring board is manufactured. SOLUTION: On both faces of a green sheet 1 containing material powder for forming a ceramic wiring board, first constraint sheets 8 are laminated which contain glass powder and ceramic powder which does not sinter at a baking temperature of the material powder for forming the wiring board. Then, on both faces of the laminate having the first constraint sheets 8 laminated, second constraint sheets 9 are laminated which contain the ceramic powder that does not sinter at the baking temperature of the material powder for forming the wiring board and which do not materially contain glass powder. Thereafter, the composite sheet laminate 11 is baked and then the first and second constraint sheets 8 and 9 are removed. |
