| 摘要 |
PROBLEM TO BE SOLVED: To provide electron beam curing conductive paste capable of easily forming an antenna, a circuit of a printed circuit board, a conductor layer for connecting layers, and electrodes of a display device, and the like, and using in place of solder for connecting an IC chip. SOLUTION: This electron beam curing conductive paste contains conductive powder and electron beam curing component containing a compound curing with electron beams. The conductive powder contains 80 or more mass % in total conductive powder of a mixture of (1) conductive dendritic powder having an average particle size of 0.05-1 μm and (2) flake conductive powder having an average particle size of 1-10 μm, having a ratio of mass of 60/40 to 95/5 in (1)/(2). |
