发明名称 SEALING METHOD AND DEVICE FOR CERAMIC PACKAGE OF SURFACE ACOUSTIC WAVE FILTER
摘要 PROBLEM TO BE SOLVED: To provide a sealing device of a ceramic package that applies primary sealing between a ceramic main body and a metallic case and then applies secondary sealing to the circumferential edge of the metallic case so as to obtain an excellent shield effect against external electromagnetic fields through double sealing in order to protect the chip component contained in the ceramic main body in the case of applying ceramic packaging to a surface acoustic wave filter that sensitively reacts upon the external environment. SOLUTION: The sealing of the ceramic package (100) is characterized in that a step difference (160) is formed at an upper side of the ceramic main body (110) of the ceramic package and the primary sealing is applied between the ceramic main body and the metallic case so as to adhere and fix the main body to the bottom face of the metallic case (170) by applying an epoxy resin or insulating adhesives onto the step difference (160) and the secondary sealing is applied to the circumferential edge so that the metallic case (170) and the ceramic main body (110) are soldered or adhered with a conductive adhesive to protect the surface electrode layer (220) formed on the surface of the ceramic main body (110).
申请公布号 JP2002198773(A) 申请公布日期 2002.07.12
申请号 JP20010146093 申请日期 2001.05.16
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 JEONG SEUNG GYO;SHIN JI HWAN
分类号 H01L23/02;C04B37/02;H01L21/50;H01L23/10;H03H3/08;H03H9/25 主分类号 H01L23/02
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