| 摘要 |
PROBLEM TO BE SOLVED: To provide an infrared rays data communication module wherein a trench-shaped connection terminal formed on a side surface of a substrate can be prevented from being filled and choked with resin for forming a resin package or resist material for forming a protective film on the surface of the substrate. SOLUTION: This infrared rays data communication module is provided with the substrate wherein component groups including a light emitting element and a light receiving element are mounted on a single surface, and a resin package which is so formed that the component groups are sealed and the single surface of the substrate is covered wholly. On the side surface of the substrate, the trench-shaped connection terminal which is stretched in the whole part in the thickness direction of the substrate and has a conductor layer on an inner peripheral surface is formed. Aperture parts of the resin package side in the connection terminal are previously choked with conductive choking pads which are electrically connected with the conductor layer. |
