摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounting device and method capable of improving a component mounting work speed by improving a speed to supply a printed circuit board to a component mounting work position by a surface mounting device or a speed to eject the printed circuit board whose component mounting is completed. SOLUTION: This device for mounting surface components on a printed circuit board is constituted of a plurality of transfers for supplying a printed circuit board on which components to be supplied from a component supplying part are mounted by a head unit for absorbing the components by moving in X and Y axial directions by X and Y gantries set on a base frame, and for mounting the absorbed components on the printed circuit board, or for accumulating the ejected printed circuit board and a plurality of conveyers set at prescribed positions on the base frame so as to be horizontally moved in prescribed directions for receiving the printed circuit board supplied from the plurality of transfers, and for transferring the printed circuit board to a component mounting position, and for ejecting the printed circuit board whose component mounting is completed to the plurality of transfers. |