SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, SYSTEM AND METHOD FOR DESIGNING CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device in which the lines of different layers are connected electrically through vias and the line width of a connection terminal is limited within a maximum width. SOLUTION: A plurality of vias 50 are arranged annularly in a region where an upper layer line 40 overlaps a lower layer line 30. A pillar 60 is created in a region surrounded by the plurality of vias 50. Since the pillar 60 is provided, line width is limited at an interlayer connection terminal. Furthermore, good connection state can be ensured by the vias 50 arranged around the pillar 60.