| 摘要 |
The invention concerns a packaging case for semiconductor wafers previously individually packed in rigid containers (1). The case comprises a body (20) made of foam including at least a base (21) and two mutually opposite sides (22, 23), said three walls being provided with uniformly spaced grooves (24) for receiving a container, and a cover (40). A rigidifying casing (30) encloses the foam body.
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