| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a resist pattern that has superior adhesion to a lower layer, and at the same time profile with an ideal rectangular section without peeling even if resist having strong hydrophobic properties is used. SOLUTION: This resist pattern formation method includes a process for forming a lower-layer film (103) having polymer containing fluorine on a wafer substrate (101), a process for forming a resist film (104) on the lower-layer film, and a process for allowing the resist film to be subjected to pattern exposure and processing for obtaining the resist pattern (105). |
