METHOD AND DEVICE FOR EVALUATING WIRE BONDING AND ITS RECORDING MEDIUM

摘要

PROBLEM TO BE SOLVED: To evaluate a wire bonding characteristics visually and quantitatively. SOLUTION: In a wire bonding process for a semiconductor element, bonding charrcteristics are judged from the form of a graph which displays the cosselation between bonding condition parameters of a wire bonding device and a tensile-rupture strength of a wire bonded under the condition. A point of inflection of a wire tensile-rupture strength in the correlation graph is taken as an evaluation condition for bonding characteristics of an element mounting base martial. An ultrasonic wave application time and ultrasonic wave application power are changed at the same time to acquire the point of inflection for wire tensile-rupture strength. The center in the stable region of the correlation graph is taken as a process condition for wire bonding.