发明名称 Electrical or electronic component encapsulated in a sealed manner and process for producing it
摘要 This electrical or electronic component with sealed encapsulation comprises: a support (1) intended to house one or more electrical or electronic components (5) from which electrically conducting tracks (6) radiate towards the periphery of the said support; and a protective and sealing casing (2) attached to the said support and hermetically sealed with respect to the latter by means of a peripheral metal bead (7), the main part of the casing, intended to be placed opposite the said support (1), being provided with hollow conducting elements (3) which pass right through the thickness of the said casing, and from the external upper end of which elements (3) electrically conducting metal tracks (9) radiate towards the periphery of the casing, the internal lower end of which elements (3) being connected to at least one electrical connection track (6) provided on the said support via a metal hybridization ball (8).
申请公布号 US2002090803(A1) 申请公布日期 2002.07.11
申请号 US20020068576 申请日期 2002.02.05
申请人 SOCIETE FRANCAISE DE DETECTEURS INFRAROUGES- SOFRADIR 发明人 SALAVILLE ANDRE
分类号 H01L23/10;(IPC1-7):H01L21/20 主分类号 H01L23/10
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