发明名称 PROCESSING METHOD FOR FORMING DISLOCATION-FREE SILICON-ON-INSULATOR SUBSTRATE PREPARED BY IMPLANTATION OF OXYGEN
摘要 A SIMOX semiconductor structure is provided that may include a silicon substrate, a doped glass layer formed on the silicon substrate by ion implantation and a silicon layer formed on the silicon substrate. Ion implantation may form the doped glass layer to reduce the dislocation density of the silicon layer.
申请公布号 US2002089032(A1) 申请公布日期 2002.07.11
申请号 US19990379058 申请日期 1999.08.23
申请人 HUANG FENG-YI 发明人 HUANG FENG-YI
分类号 C23C14/48;H01L21/02;H01L21/265;H01L21/762;H01L27/12;(IPC1-7):H01L29/00 主分类号 C23C14/48
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