发明名称 |
Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing |
摘要 |
An electrolytic polishing apparatus for electrolytic-polishing a conductive film subject to formed on a substrate including a resistance measuring unit for measuring the resistance of the film. The electrolytic polishing apparatus may also include a termination point detecting portion for detecting a termination point of polishing by reading a variation of the resistance value measured by the resistance measuring unit, or a polishing control portion for terminating electrolytic polishing on the basis of the termination point of polishing detected by the termination point detecting portion.
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申请公布号 |
US2002090884(A1) |
申请公布日期 |
2002.07.11 |
申请号 |
US20010922135 |
申请日期 |
2001.08.03 |
申请人 |
NOGAMI TAKESHI;KOMAI NAOKI;KITO HIDEYUKI;TAGUCHI MITSURU |
发明人 |
NOGAMI TAKESHI;KOMAI NAOKI;KITO HIDEYUKI;TAGUCHI MITSURU |
分类号 |
B23H5/08;B23H9/00;B24B37/013;B24B37/04;B24B49/04;C25F3/16;H01L21/00;(IPC1-7):B24B49/00 |
主分类号 |
B23H5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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