Printed circuit board for improving cooling effect with an SMD component has holes near a component to be cooled with regard to contact/cooling surfaces of the component to be cooled.

摘要

A hole (7) is provided in a printed circuit board in the area of a component (1) to be cooled. The hole has a total cross section hole in respect of a contact or cooling surface for the component to be cooled. This total cross section hole is greater than 40 percent of the contact or cooling surface of the component. A heat-conductive insert (11) fits inside the hole. The insert is soldered to the contact or cooling surface on the underside of the component to be cooled. An Independent claim is also included for a method for producing a printed circuit board with a cooled SMD component.