| 摘要 |
PURPOSE: A multiple wire bonding apparatus is provided to perform a wire bonding process regarding all of the wires of a semiconductor chip within an interval of time that a bonding process for one wire is performed, by simultaneously bonding all of the bonding pads on the semiconductor chip through a multiple capillary. CONSTITUTION: At least one bonding unit has a plurality of capillaries(210) for wire bonding. At least one transfer unit(203,204) transfers the bonding unit in a vertical direction and in a horizontal direction. The bonding unit is installed in a side of the transfer unit. A control unit controls the transfer unit so that the plurality of capillaries are simultaneously positioned in the first and second bonding points, connected to the transfer unit.
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