发明名称 |
Heated filling device |
摘要 |
A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a heating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure fill head includes the steps of causing fill material to enter the fill head\, modifying the viscosity of the fill material while it is within the fill head, and causing the modified viscosity fill material to exit the fill head and enter at least one hole.
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申请公布号 |
US2002088840(A1) |
申请公布日期 |
2002.07.11 |
申请号 |
US20010026135 |
申请日期 |
2001.12.20 |
申请人 |
PEDIGO JESSE;MEYER TIMOTHY |
发明人 |
PEDIGO JESSE;MEYER TIMOTHY |
分类号 |
H05K3/00;H05K3/12;H05K3/40;(IPC1-7):B23Q15/00;B23K1/00 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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