发明名称 Heated filling device
摘要 A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a heating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure fill head includes the steps of causing fill material to enter the fill head\, modifying the viscosity of the fill material while it is within the fill head, and causing the modified viscosity fill material to exit the fill head and enter at least one hole.
申请公布号 US2002088840(A1) 申请公布日期 2002.07.11
申请号 US20010026135 申请日期 2001.12.20
申请人 PEDIGO JESSE;MEYER TIMOTHY 发明人 PEDIGO JESSE;MEYER TIMOTHY
分类号 H05K3/00;H05K3/12;H05K3/40;(IPC1-7):B23Q15/00;B23K1/00 主分类号 H05K3/00
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