发明名称 |
Chemical mechanical planarization belt assembly and method of assembly |
摘要 |
A method of producing a chemical mechanical planarization (CMP) polishing belt structure is disclosed that includes forming a strip of substantially rigid material into a support belt having an interior surface and an exterior surface. At least a portion of the exterior surface of the support belt is altered to form a plurality of gripping members integral with the exterior surface of the support belt. An interior surface of a seamless CMP belt is applied to the exterior surface of the support belt such that the plurality of gripping members engage the interior surface of the seamless CMP belt in a non-slip grip.
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申请公布号 |
US2002090899(A1) |
申请公布日期 |
2002.07.11 |
申请号 |
US20010757452 |
申请日期 |
2001.01.09 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
LACY MICHAEL S.;BOYD JOHN M. |
分类号 |
B24B37/04;B24D11/02;(IPC1-7):B24B7/22;B24B21/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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